技術(shù)能力
|
No. |
項(xiàng)目 Item |
技術(shù)指標(biāo) Capability |
|
| 1 |
層數(shù) |
No. of Layer |
2-16 (層)(layers) |
| 2 |
完成板尺寸(最大) |
Finished Board Size(Max) |
21.5”x24.5”(546mmx622mm) |
| 3 |
完成板尺寸(最小) |
Finished Board Size(Min) |
3.0”x2.0”(76mm x51mm) |
| 4 |
板厚度 |
Board Thickness |
0.126”-0.016”(0.4mm-3.2mm) |
| 5 |
成品厚度公差 |
Finished Board Thickness Tolerance |
±10% ±3m il (board thickness < 0.8m m) |
| 6 |
板曲(最小) |
Warpage(Min) |
<0.75% |
| 7 |
鉆孔孔徑 |
Drill Hole Diameter |
0.005”-0.255”(0.15mm-6.5mm) |
| 8 |
外層底銅厚度 |
Base Copper Thickness of Outer Layer |
1/3OZ-3OZ （0.012mm-0.102mm） |
| 9 |
內(nèi)層底銅厚度 |
Base Copper Thickness of Inner Laver |
1/2OZ-3OZ (0.017mm-0.105mm) |
| 10 |
板料類(lèi)型 |
Laminate |
FR-4 (130℃Tg-180℃g)、CEM-3、Roadbed slab |
| 11 |
孔電鍍縱橫比(最大) |
Aspect Ratio of Plated Hole (Max） |
10:1 |
| 12 |
孔徑公差 (鍍通孔) |
Hole Diameter Tolerance (PTH) |
±3m il(±0.075mm) |
| 13 |
孔徑公差(非鍍通孔) |
Hole Diameter Tolerance (NPTH) |
±1m il(±0.025mm) |
| 14 |
孔壁銅厚 |
Copper Thickness of PTH Wall |
≥0.8m il(≥0.020m m) |
| 15 |
內(nèi)層線寬間距(最小) |
Line Width/Space of Inner Layer(Min) |
H/HOZ 3.0mi1/3.0mil（0.075mm/0.075mm) 1/1OZ 4mil/4mil (0.1016mm / 0.1016mm) 2/2OZ 5mil / 5mil (0.127mm/0.127mm) 3/3OZ 6mil/6mi1 (0.152mm/0.152mm) |
| 16 |
外層線寬間距(最小) |
Line Width/Space of Outer Layer (Min) |
T/TOZ 3.0mil/3.0mil(0.075m/0.075mm） H/H0Z 3.5mil/3.5mil(0.089mm/0.089mm) 1/1OZ 4.5mil/4.5mil(0.114mm/0.114mm) 2/2OZ 6mil/6mil (0.152mm/0.152mm) 3/3OZ 7m il/7mil (0.152mm/0.152mm) |
| 17 |
阻焊橋?qū)?最小) |
Solder Mask Bridge(Min) |
2.5mil (0.064mm) |
| 18 |
外形公差(孔到邊)(最小) |
Dimension Tolerance(Hole to Edge)(Min) |
±4m il(±0.101mm) |
| 19 |
熱沖擊 |
Thermal Shock |
288℃ 10/second (3 times) |
| 20 |
離子污染測(cè)試 |
lonic Contamination |
<1.56ug/cm2 ( NaCl) |
| 21 |
抗剝離強(qiáng)度 |
Anti-Peelable Strength |
≥1.4N/mm2 |
| 22 |
特性阻抗控制 |
Impedance Control |
±10% |
| 23 |
阻焊劑強(qiáng)度 |
Solder mask strength |
>6H |
| 24 |
表面處理 |
Surface treatment |
電鎳/金，無(wú)鉛噴錫，抗氧化，沉金，碳油，藍(lán)膠等 |